Set #2 – BGA Laptop Repair + PS3 + Xbox 360 Video Training Course – 4 Full HD Videos Training Courses

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Set #2 – BGA Laptop Repair + PS3 + Xbox 360 Video Training Course – 4 Full HD Videos Training Courses

149.99 99.99

 This set #2 contains these Video Training Tutorials:

  • Xbox 360: Professional GPU, CPU and RAM
  • Playstation 3: Professional RSX Reballing Video Training
  • Playstation 3: Professional CELL Reballing Video Training
  • LAPTOP HP COMPAQ 6735s GPU RADEON PA4912 REBALLING GUIDE
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Description

Set #2 – BGA Laptop Repair + PS3 + Xbox 360 Video Training Course – 4 Full HD Videos Training Courses


 This set #2 contains these Video Training Tutorials:

  • Xbox 360: Professional GPU, CPU and RAM

  • Playstation 3: Professional RSX Reballing Video Training

  • Playstation 3: Professional CELL Reballing Video Training

  • LAPTOP HP COMPAQ 6735s GPU RADEON PA4912 REBALLING GUIDE

 

Course Information:

Course: Xbox 360: Professional GPU, CPU and RAM Reballing Video Training
Machine used: Achi IR-PRO
Author: UKENtv Company
Release Date: 2015-03-14 (version 1.0)
Duration: 2h 10min
Language: English
Resolution: FullHD (1080p , 1920×1080)
Video Format: WMV (Windows Media Video)
Version: 1.0
Digital Download Version

Course Description:

Reballing performed in the Xbox 360 console is not an easy task. This course will show you step-by-step how to perform it, without damaging the console. Perfectly solder the GPU, CPU and RAM. It gives you the opportunity to become the best professional service company in the field of Microsoft XBox 360.


Course Overview:

  • Introduction
    • The best and safe equipment used for the reballing process
    • Calibration and settings of the Achi IR-PRO rework station
  • The GPU Unit
    • First stage – Preparation
      • Using the aluminium tape to protect the elements on the board (especially capacitors)
      • Preventing the board from bending
    • Second stage – Removing the GPU
      • Heating the motherboard and the unit in order to remove the GPU unit
      • Precise temperature profile and explenation of its importance
      • How to determine when the GPU Unit is ready to be removed
      • Removing the GPU Unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the GPU unit
      • Removing the old solder from the GPU Unit
      • Perfect soldering of new balls to the processor with the usage of stencils
    • Fourth Stage – Soldering back the GPU unit
      • Soldering back the GPU Unit
      • Precise temperatures and length for the soldering process
      • Making sure that the GPU has been soldered properly

    The CPU Unit

    • First stage – Preparation
      • Using the aluminium tape to protect the elements on the board (especially capacitors)
      • Preventing the board from bending
    • Second stage – Removing the CPU
      • Heating the motherboard and the unit in order to remove the CPU unit
      • Precise temperature profile and explenation of its importance
      • How to determine when the CPU Unit is ready to be removed
      • Removing the CPU Unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the CPU unit
      • Removing the old solder from the CPU Unit
      • Perfect soldering of new balls to the processor with the usage of stencils
    • Fourth Stage – Soldering back the CPU unit
      • Soldering back the CPU Unit
      • Precise temperatures and length for the soldering process
      • Making sure that the CPU has been soldered properly
  • The RAM Unit
    • First stage – Preparation
      • Using the aluminium tape to protect the elements on top of the board
      • The RAM to be reballed is on the bottom side of the motherboard (harder task to perform!)
      • Preventing the board from bending
    • Second stage – Removing the RAM
      • Heating the motherboard and the unit in order to remove the RAM unit
      • Precise temperature profile and explenation of its importance
      • How to determine when the RAM Unit is ready to be removed
      • Removing the RAM Unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the RAM unit
      • Removing the old solder from the RAM Unit
      • Perfect soldering of new balls to the RAM memory with the usage of stencils
      • Precise correction of small 0,5 balls
    • Fourth Stage – Soldering back the RAM unit
      • Soldering back the RAM Unit
      • Precise temperatures and length for the soldering process
      • Making sure that the RAM has been soldered properly

Course Information:

Course: Playstation 3: Professional RSX Reballing Video Training
Machine used: Achi IR-PRO
Author: UKENtv Company
Release Date: 2015-03-14 (version 1.0)
Duration: 1h 27min
Language: English
Resolution: FullHD (1080p , 1920×1080)
Video Format: WMV (Windows Media Video)
Version: 1.0
Digital Download Version

Course Description:

The reballing process in the Sony Playstation 3 console is considered to be one of the hardest tasks. In this course we will show you how to perform the RSX Unit reballing, without damaging the console. It is indeed a hard task, but with hints and information included in our Video Training we give you the opportunity to become the most professional service company in the field of Sony Playstation 3.


Course Overview:

  • Introduction
    • The best and safe equipment used for the reballing process
    • Calibration and settings of the Achi IR-PRO rework station
  • Reballing of the RSX (GPU) Unit
    • First stage – Preparation
      • Using the aluminium tape to protect the elements on the board
      • Preventing the board from bending
    • Second stage – Removing the RSX
      • Heating the motherboard and the unit in order to remove it
      • Precise temperature profile and explenation of its importance
      • How to determine when the RSX Unit is ready to be removed
      • Removing the RSX Unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the RSX unit
      • Removing the old solder from the RSX Unit
      • Perfect soldering of new balls to the processor with the usage of stencils
    • Fourth Stage – Soldering back the RSX unit
      • Soldering back the RSX Unit
      • Precise temperatures and length for the soldering process
      • Explanation of the importance of four small capacitors under the unit
      • Making sure that the RSX has been soldered properly

Course Information:

Course: Playstation 3: Professional CELL Reballing Video Training
Machine used: Achi IR-PRO
Author: UKENtv Company
Release Date: 2015-03-13 (version 1.0)
Duration: 1h 40min
Language: English
Resolution: FullHD (1080p , 1920×1080)
Video Format: WMV (Windows Media Video)
Version: 1.0
Digital Download Version

Course Description:

The reballing process in the Sony Playstation 3 console is considered to be one of the hardest tasks. In this course we will show you how to perform the CELL Unit reballing, without damaging the console. It is indeed a hard task, much harder than the RSX reballing, but with hints and information included in our Video Training we give you the opportunity to become the most professional service company in the field of Sony Playstation 3.


Course Overview:

  • Introduction
    • The best and safe equipment used for the reballing process
    • Calibration and settings of the Achi IR-PRO rework station
  • Reballing of the CELL (CPU) Unit
    • First stage – Preparation
      • Using the aluminium tape to protect the elements on the board
      • Preventing the board from bending
    • Second stage – Removing the CELL
      • Heating the motherboard and the unit in order to remove it
      • Precise temperature profile and explenation of its importance
      • How to determine when the CELL Unit is ready to be removed
      • Removing the CELL Unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the CELL unit
      • Removing the old solder from the CELL Unit
      • Information about the stencils avaiable for the CELL Unit
      • Perfect soldering of new balls to the processor with the usage of stencils
    • Fourth Stage – Soldering back the CELL unit
      • Soldering back the CELL Unit
      • Precise temperatures and length for the soldering process
      • Explanation of the importance of four small capacitors under the unit
      • Making sure that the CELL has been soldered properly

Course Information:

Course: LAPTOP HP COMPAQ 6735s GPU RADEON PA4912 REBALLING GUIDE
Machine used: Achi IR-PRO
Author: UKENtv Company
Release Date: 2015-03-22 (version 1.0)
Duration: 1h 18min
Language: English
Resolution: FullHD (1080p , 1920×1080)
Video Format: WMV (Windows Media Video)
Version: 1.0
Digital Download Version

Course Description:

The reballing process in the notebooks is a hard task. In this course we will show you how to perform the GPU (RADEON PA4912) reballing, without damaging the motherboard. It is indeed a hard task, the GPU unit has a red glue on the edges which makes it harder to desoler, but with hints and information included in our Video Training we give you the opportunity to become the most professional service company in the field of notebooks.

 

Course Overview:

  • Introduction
    • The best and safe equipment used for the reballing process
    • Calibration and settings of the Achi IR-PRO rework station
  • Reballing of the GPU (RADEON PA4912) Unit
    • First stage – Preparation
      • Using the aluminium tape to protect the elements on the board (IC’s, plastic ports etc.)
      • Preventing the board from bending
      • Removing the red glue
    • Second stage – Removing the GPU (RADEON PA4912)
      • Heating the motherboard and the unit in order to remove it
      • Precise temperature profile and explenation of its importance
      • How to determine when the GPU unit is ready to be removed, despite some amount of glue remainings
      • Removing the GPU unit from the motherboard
      • Removing the old solder from the motherboard
    • Third Stage – the GPU (RADEON PA4912) unit
      • Removing the old solder from the GPU Unit
      • Perfect soldering of new 0,5 balls to the processor with the usage of stencils
    • Fourth Stage – Soldering back the GPU (RADEON PA4912) unit
      • Soldering back the GPU Unit
      • Precise temperatures and length for the soldering process
      • Making sure that the RADEON PA4912 has been soldered properly

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